News

Polyimide Film Used in Mobile Phones and Its Future

1. What is Polyimide film ?

PI (Polyimide) is a general term for an aromatic heterocyclic polymer compound containing an imide group in its molecular structure.

Polyimide is the most heat-resistant variety of polymer materials that have been industrialized, and is used as a film, coating, plastic, composite, adhesive, foam, fiber, separation film, liquid crystal aligning agent, photoresist, etc. Widely used in high-tech fields.

Polyimide (PI) film is widely used in aviation, marine, spacecraft, rocket missiles, atomic energy, electronic and electrical industries as insulation materials. Polyimide Film is the most common commercial success of polyimide and is the most widely used.

2. Polyimide film used in mobile parts and its application

1. FPC Soft Board and Reinforced Board

A flexible circuit board, also known as FPC board, is a printed circuit made of a flexible insulating substrate. The conventional flexible board has a multi-layer structure composed of a copper foil, an insulating substrate, a cover film, etc., generally using copper foil as a conductor circuit material, and a PI film as a circuit insulating substrate.

There is a reinforced materials required under the BLACK LCP Anetanna. The thickness is around 0.225 ~ 0.25 mm. Generally would use PI. But it is difficult for PI to be so thick, and with suitable dielectric constant.

With time passed, there were manufacturers who used a composite process, which was compounded with epoxy resin or acrylic hot melt adhesive, which was easy to layer and low in rigidity. After die cutting, the phenomenon of overflowing glue is serious.